PACK EXPO International (Nov 3-6)

When: November 3-6

Where: McCormick Place, Chicago, IL

Miura, the leaders in modular steam boiler technology, is excited to be attending PACK EXPO International, the largest and most comprehensive packaging and processing trade show in the hemisphere and the world in 2024. Held biennially at McCormick Place in Chicago, this premier event offers an unparalleled opportunity for industry suppliers and end-users from a diverse array of consumer packaged goods (CPG) companies and life sciences to connect.

Key Highlights:

Automation and Robotics
Printing and Labeling
Materials and Containers
Remote Operation
Processing Equipment
Supply Chain, Track & Trace Technology

Where Everyone in the Industry Converges The event attracts plant managers, engineers, C-level executives, corporate management, purchasers, and other professionals from over 40 industries, including:

Food & Beverage
Healthcare and Personal Care
Household Products
Pet Care
Industrial Products (Chemicals, Paper, Construction)
E-Commerce and Warehouse Distribution

Miura is looking forward to showcasing our innovative solutions and engaging with industry professionals to explore the future of packaging and processing technologies. Join us at PACK EXPO International to see how we are leading the way in modular steam boiler technology.

For more info, visit here.